TC500AIJE
vs
TC500ACPE
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-XDIP-T16
|
R-PDIP-T16
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
2.5 mA
|
2.5 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Package Description |
|
DIP-16
|
| JESD-609 Code |
|
e0
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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