TC74AC32F(TP1) vs 74AHC32PW-T feature comparison

TC74AC32F(TP1) Toshiba America Electronic Components

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74AHC32PW-T NXP Semiconductors

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Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description SOP, TSSOP, TSSOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Family AC AHC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 8.5 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 9.5 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 74AHC32PW-T with alternatives