TC74HC00AF vs GD54HC00J feature comparison

TC74HC00AF Toshiba America Electronic Components

Buy Now Datasheet

GD54HC00J LG Semicon Co Ltd

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP, SOP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family HC/UH
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e0 e0
Length 10.3 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Equivalence Code SOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Prop. Delay@Nom-Sup 19 ns 27 ns
Propagation Delay (tpd) 95 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm
Base Number Matches 1 2

Compare TC74HC00AF with alternatives