TC74HC00AF vs M38510/65001BCX feature comparison

TC74HC00AF Toshiba America Electronic Components

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M38510/65001BCX Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description SOP, SOP14,.3 DIP,
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e0
Length 10.3 mm 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Prop. Delay@Nom-Sup 19 ns 21 ns
Propagation Delay (tpd) 95 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.9 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT APPLICABLE
Power Supply Current-Max (ICC) 0.01 mA
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE

Compare TC74HC00AF with alternatives

Compare M38510/65001BCX with alternatives