TC74HC00AF vs MM74HC132MX feature comparison

TC74HC00AF Toshiba America Electronic Components

Buy Now Datasheet

MM74HC132MX onsemi

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code SOIC
Package Description SOP, SOP14,.3 SOIC-14
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 10.3 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 19 ns 37 ns
Propagation Delay (tpd) 95 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1.9 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 3.9 mm
Base Number Matches 1 5
Pbfree Code Yes
Manufacturer Package Code 751EF
Factory Lead Time 48 Weeks, 5 Days
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare TC74HC00AF with alternatives

Compare MM74HC132MX with alternatives