Findchips: Compare TC74HC00AF-EL vs 74HC03DB,112

TC74HC00AF-EL vs 74HC03DB,112 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	TOSHIBA CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	SSOP1
Package Description	SOP,	SOT-337-1, SSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	10.3 mm	6.2 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	19 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.9 mm	2 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	TIN LEAD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	5.3 mm	5.3 mm
Base Number Matches	1	2
Manufacturer Package Code		SOT337-1
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Output Characteristics		OPEN-DRAIN
Package Equivalence Code		SSOP14,.3
Packing Method		BULK
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		29 ns
Schmitt Trigger		NO
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates