TC74HC00AF-TP1 vs CD54HC00F/3 feature comparison

TC74HC00AF-TP1 Toshiba America Electronic Components

Buy Now Datasheet

CD54HC00F/3 Intersil Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP HARRIS SEMICONDUCTOR
Part Package Code SOIC
Package Description SOP, ,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-CDIP-T14
JESD-609 Code e0
Length 10.3 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 19 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm
Base Number Matches 1 3

Compare TC74HC00AF-TP1 with alternatives

Compare CD54HC00F/3 with alternatives