TC74HC00AF-TP1EL vs 74HC03DB-Q100 feature comparison

TC74HC00AF-TP1EL Toshiba America Electronic Components

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74HC03DB-Q100 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 19 ns 145 ns
Qualification Status Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Output Characteristics OPEN-DRAIN
Screening Level AEC-Q100

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