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TC74HC00AFN vs CD74HCT00EX feature comparison

TC74HC00AFN Toshiba America Electronic Components

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CD74HCT00EX Harris Semiconductor

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP HARRIS SEMICONDUCTOR
Part Package Code SOIC
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14
Pin Count 14
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 1 3
Family HCT
JESD-30 Code R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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