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TC74HC00AFN vs DV74HCT132AN feature comparison

TC74HC00AFN Toshiba America Electronic Components

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DV74HCT132AN avg Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP AVG SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14 PLASTIC, DIP-14
Pin Count 14 14
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 1 1
Family HCT
JESD-30 Code R-PDIP-T14
Length 18.86 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

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Compare DV74HCT132AN with alternatives

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