TC74HC00AFN vs MM74HC00M feature comparison

TC74HC00AFN Toshiba America Electronic Components

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MM74HC00M onsemi

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Pbfree Code Yes Yes
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code SOIC
Package Description SOP, SOP14,.25 SOIC-14
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba onsemi
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 19 ns 23 ns
Propagation Delay (tpd) 95 ns 113 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 5
Manufacturer Package Code 751A-03
Factory Lead Time 27 Weeks, 4 Days
Moisture Sensitivity Level 1
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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