Findchips: Compare TC74HC00AFN-ELP vs 74HCT00D,653

TC74HC00AFN-ELP vs 74HCT00D,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Source Content uid	TC74HC00AFN-ELP	74HCT00D,653
Pbfree Code	No
Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	TOSHIBA CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	SOIC
Package Description	SOP,	SO-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HCT
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4	e4
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Propagation Delay (tpd)	19 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	3.9 mm
Base Number Matches	1	2
Manufacturer Package Code		SOT108-1
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP14,.25
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		29 ns
Schmitt Trigger		NO
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates