TC74HC00AFN-ELP vs MC74HC03ADR2 feature comparison

TC74HC00AFN-ELP Toshiba America Electronic Components

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MC74HC03ADR2 Rochester Electronics LLC

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Pbfree Code No Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 19 ns 180 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 5
Moisture Sensitivity Level NOT SPECIFIED
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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