TC74HC00AFN-ELP vs MM74HC00SJX feature comparison

TC74HC00AFN-ELP Toshiba America Electronic Components

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MM74HC00SJX Fairchild Semiconductor Corporation

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Pbfree Code No Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOP
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 8.65 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 19 ns 113 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 1 3
Manufacturer Package Code 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE
ECCN Code EAR99
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

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