TC74HC00APF vs MC74HC00ANG feature comparison

TC74HC00APF Toshiba America Electronic Components

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MC74HC00ANG

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
Samacsys Manufacturer Toshiba
Family HC/UH
JESD-30 Code R-PDIP-T14
Length 19.25 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1

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