TC74HC00APF vs 74HC00D-Q100,118 feature comparison

TC74HC00APF Toshiba America Electronic Components

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74HC00D-Q100,118 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP NEXPERIA
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day 6 Weeks
Samacsys Manufacturer Toshiba Nexperia
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE TR, 13 INCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Manufacturer Package Code SOT108-1
JESD-609 Code e4
Moisture Sensitivity Level 1
Screening Level AEC-Q100
Terminal Finish NICKEL PALLADIUM GOLD SILVER

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