TC74HC00APF
vs
74HC00N,652
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
NXP
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Length
19.25 mm
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
BULK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
19 ns
27 ns
Propagation Delay (tpd)
95 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
4.45 mm
4.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Manufacturer Package Code
SOT27-1
ECCN Code
EAR99
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Terminal Finish
NICKEL PALLADIUM GOLD
Compare TC74HC00APF with alternatives
Compare 74HC00N,652 with alternatives