TC74HC00APF
vs
MC74HC00ADR2G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
ONSEMI
Part Package Code
DIP
SOIC-14 NB
Package Description
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
onsemi
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
Length
19.25 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.0052 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Packing Method
TUBE
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Prop. Delay@Nom-Sup
19 ns
55 ns
Propagation Delay (tpd)
95 ns
110 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
4.45 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
7.62 mm
3.9 mm
Base Number Matches
1
2
Manufacturer Package Code
751A-03
ECCN Code
EAR99
Factory Lead Time
7 Weeks
JESD-609 Code
e3
Moisture Sensitivity Level
1
Terminal Finish
MATTE TIN
Compare TC74HC00APF with alternatives
Compare MC74HC00ADR2G with alternatives