TC74HC00APF vs SN74HC00ADBRE4 feature comparison

TC74HC00APF Toshiba America Electronic Components

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SN74HC00ADBRE4 Texas Instruments

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SSOP
Package Description DIP, DIP14,.3 SSOP,
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 5.3 mm
Base Number Matches 1 1
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish NICKEL PALLADIUM GOLD

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