TC74HC00APF vs SN74HC00DT feature comparison

TC74HC00APF Toshiba America Electronic Components

Buy Now Datasheet

SN74HC00DT Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 53 Weeks, 1 Day
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns 115 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 1 2

Compare TC74HC00APF with alternatives

Compare SN74HC00DT with alternatives