TC74HC03AFN-ELP vs SNJ54HC03J feature comparison

TC74HC03AFN-ELP Toshiba America Electronic Components

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SNJ54HC03J Texas Instruments

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Pbfree Code No Yes
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 8.65 mm 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 19 ns 155 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
ECCN Code EAR99
JESD-609 Code e0
Max I(ol) 0.0052 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 36 ns
Schmitt Trigger NO
Screening Level MIL-PRF-38535
Terminal Finish Tin/Lead (Sn/Pb)

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