TC74HC03AFN-ELP vs TC74HC03AP feature comparison

TC74HC03AFN-ELP Toshiba America Electronic Components

Buy Now Datasheet

TC74HC03AP Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 19 ns 95 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 19 ns
Schmitt Trigger NO

Compare TC74HC03AFN-ELP with alternatives

Compare TC74HC03AP with alternatives