TC74HC107AFN
vs
MC74HC107D
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.25
|
SOP, SOP14,.25
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NOT AVAILABLE IN JAPAN
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
8.65 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
20000000 Hz
|
| Max I(ol) |
0.0052 A
|
0.004 A
|
| Number of Bits |
2
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP14,.25
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
155 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
3.9 mm
|
|
| fmax-Min |
80 MHz
|
|
| Base Number Matches |
1
|
3
|
| JESD-609 Code |
|
e0
|
| Power Supplies |
|
2/6 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TC74HC107AFN with alternatives