TC74HC112AF-TP2 vs JM38510/30103B2X feature comparison

TC74HC112AF-TP2 Toshiba America Electronic Components

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JM38510/30103B2X Texas Instruments

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Pbfree Code No
Rohs Code No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description SOP, QCCN,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-PDSO-G16 S-CQCC-N20
JESD-609 Code e0
Length 10.3 mm 8.885 mm
Load Capacitance (CL) 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP QCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Propagation Delay (tpd) 31 ns 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 5.3 mm 8.885 mm
fmax-Min 24 MHz 30 MHz
Base Number Matches 1 1

Compare TC74HC112AF-TP2 with alternatives

Compare JM38510/30103B2X with alternatives