TC74HC112AF-TP2 vs SN74LS112ANSRE4 feature comparison

TC74HC112AF-TP2 Toshiba America Electronic Components

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SN74LS112ANSRE4 Texas Instruments

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 31 ns 20 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 5.25 V
Supply Voltage-Min (Vsup) 2 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 24 MHz 45 MHz
Base Number Matches 1 1
Max Frequency@Nom-Sup 30000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 6 mA
Time@Peak Reflow Temperature-Max (s) 30

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