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TC74HC132AFN vs MM54HC00J feature comparison

TC74HC132AFN Toshiba America Electronic Components

Buy Now Datasheet

MM54HC00J Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code End Of Life Contact Manufacturer
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS LLC
Part Package Code SOIC DIP
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14 CERAMIC, DIP-14
Pin Count 14 14
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 1 4
Family HC/UH
JESD-30 Code R-GDIP-T14
JESD-609 Code e0
Length 19.43 mm
Logic IC Type NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 27 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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