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TC74HC132AFN-ELP Toshiba America Electronic ComponentsBuy Now Datasheet |
MM54HC132J/883 Texas InstrumentsBuy Now Datasheet |
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| Source Content uid | TC74HC132AFN-ELP | MM54HC132J/883 |
| Pbfree Code | No | |
| Rohs Code | No | No |
| Part Life Cycle Code | Obsolete | Obsolete |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP14,.25 | DIP, DIP14,.3 |
| Pin Count | 14 | |
| Reach Compliance Code | unknown | unknown |
| HTS Code | 8542.39.00.01 | 8542.39.00.01 |
| Family | HC/UH | HC/UH |
| JESD-30 Code | R-PDSO-G14 | R-GDIP-T14 |
| JESD-609 Code | e0 | e0 |
| Length | 8.65 mm | 19.43 mm |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | NAND GATE | NAND GATE |
| Max I(ol) | 0.004 A | |
| Number of Functions | 4 | 4 |
| Number of Inputs | 2 | 2 |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 85 °C | 125 °C |
| Operating Temperature-Min | -40 °C | -55 °C |
| Package Body Material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| Package Code | SOP | DIP |
| Package Equivalence Code | SOP14,.25 | DIP14,.3 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE | IN-LINE |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 240 | NOT SPECIFIED |
| Power Supplies | 2/6 V | 2/6 V |
| Prop. Delay@Nom-Sup | 28 ns | |
| Propagation Delay (tpd) | 28 ns | 37 ns |
| Qualification Status | Not Qualified | Not Qualified |
| Schmitt Trigger | YES | YES |
| Seated Height-Max | 1.75 mm | 5.08 mm |
| Supply Voltage-Max (Vsup) | 6 V | 6 V |
| Supply Voltage-Min (Vsup) | 2 V | 2 V |
| Supply Voltage-Nom (Vsup) | 5 V | 5 V |
| Surface Mount | YES | NO |
| Technology | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING | THROUGH-HOLE |
| Terminal Pitch | 1.27 mm | 2.54 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED |
| Width | 3.9 mm | 7.62 mm |
| Base Number Matches | 1 | 1 |
| Screening Level | MIL-STD-883 | |
