TC74HC132AP vs MC74HC132AND feature comparison

TC74HC132AP Toshiba America Electronic Components

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MC74HC132AND Freescale Semiconductor

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Source Content uid TC74HC132AP MC74HC132AND
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 28 ns 31 ns
Propagation Delay (tpd) 140 ns
Qualification Status Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 2 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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