TC74HC132AP vs M74HC132RM13TR feature comparison

TC74HC132AP Toshiba America Electronic Components

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M74HC132RM13TR STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 ROHS COMPLIANT, SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 215.8
CO2e (mg) 20219.441 2675.92
Samacsys Manufacturer Toshiba STMicroelectronics
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 28 ns 32 ns
Propagation Delay (tpd) 140 ns 160 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare TC74HC132AP with alternatives

Compare M74HC132RM13TR with alternatives