TC74HC132AP vs M74HC132TTR feature comparison

TC74HC132AP Toshiba America Electronic Components

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M74HC132TTR STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code DIP TSSOP
Package Description DIP, DIP14,.3 TSSOP, TSSOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 62.85
CO2e (mg) 20219.441 779.34
Samacsys Manufacturer Toshiba STMicroelectronics
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 28 ns 32 ns
Propagation Delay (tpd) 140 ns 160 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.45 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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