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TC74HC132AP vs TC74HC00AFN feature comparison

TC74HC132AP Toshiba America Electronic Components

Buy Now Datasheet

TC74HC00AFN Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Pin Count 14 14
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 28 ns 19 ns
Propagation Delay (tpd) 140 ns 95 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Additional Feature NOT AVAILABLE IN JAPAN
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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