TC74HC137AF-TP1 vs 74HC138DB-T feature comparison

TC74HC137AF-TP1 Toshiba America Electronic Components

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74HC138DB-T NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS 3 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 41 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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