TC74HC138AF-TP1 vs CY54FCT138TDMB feature comparison

TC74HC138AF-TP1 Toshiba America Electronic Components

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CY54FCT138TDMB Cypress Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description SOP, 0.300 INCH, CERDIP-16
Pin Count 16 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS 3 ENABLE INPUTS
Family HC/UH FCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e0 e0
Length 10.3 mm 19.431 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 190 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 7.62 mm
Base Number Matches 1 2
Max I(ol) 0.032 A
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 12 ns
Screening Level 38535Q/M;38534H;883B

Compare TC74HC138AF-TP1 with alternatives

Compare CY54FCT138TDMB with alternatives