TC74HC138AF-TP1 vs SN74LV138PWLE feature comparison

TC74HC138AF-TP1 Toshiba America Electronic Components

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SN74LV138PWLE Texas Instruments

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC
Package Description SOP, TSSOP, TSSOP16,.25
Pin Count 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS 3 ENABLE INPUTS
Family HC/UH LV/LV-A/LVX/H
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 10.3 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 190 ns 26 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2.7 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 5.3 mm 4.4 mm
Base Number Matches 1 1
Max I(ol) 0.012 A
Package Equivalence Code TSSOP16,.25
Packing Method TR
Prop. Delay@Nom-Sup 21 ns

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