TC74HC14AP vs 74HC20DB,118 feature comparison

TC74HC14AP Toshiba America Electronic Components

Buy Now Datasheet

74HC20DB,118 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP-14 SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 6 2
Number of Inputs 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 31 ns 27 ns
Propagation Delay (tpd) 155 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 4.45 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare TC74HC14AP with alternatives

Compare 74HC20DB,118 with alternatives