TC74HC151AFN vs CD74AC251ME4 feature comparison

TC74HC151AFN Toshiba America Electronic Components

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CD74AC251ME4 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
Samacsys Manufacturer Toshiba
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH AC
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0052 A 0.012 A
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 45 ns 20.9 ns
Propagation Delay (tpd) 175 ns 186 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.5 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
HTS Code 8542.39.00.01
JESD-609 Code e4
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Packing Method TUBE
Terminal Finish NICKEL PALLADIUM GOLD

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