TC74HC155AP vs MM54HC155J feature comparison

TC74HC155AP Toshiba America Electronic Components

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MM54HC155J National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN BE USED AS DUAL 3-TO-8 LINE DECODER
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 19.25 mm 19.43 mm
Load Capacitance (CL) 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.004 A
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 33 ns
Propagation Delay (tpd) 165 ns 44 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
JESD-609 Code e0
Terminal Finish TIN LEAD

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