TC74HC251AF(TP1) vs 74HCT151D,653 feature comparison

TC74HC251AF(TP1) Toshiba America Electronic Components

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74HCT151D,653 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOP
Package Description SOP, SO-16
Pin Count 16 16
Reach Compliance Code unknown compliant
Family HC/UH HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 45 ns 62 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT109-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Prop. Delay@Nom-Sup 57 ns

Compare TC74HC251AF(TP1) with alternatives

Compare 74HCT151D,653 with alternatives