TC74HC259AF(TP1) vs 935188770112 feature comparison

TC74HC259AF(TP1) Toshiba America Electronic Components

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935188770112 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description 0.300 INCH, PLASTIC, SOIC-16 SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 1 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 41 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type LOW LEVEL HIGH LEVEL
Width 5.3 mm 5.3 mm
Base Number Matches 3 1
HTS Code 8542.39.00.01
Moisture Sensitivity Level 1

Compare TC74HC259AF(TP1) with alternatives

Compare 935188770112 with alternatives