TC74HC32AFN(TP1) vs MM74HC32MX feature comparison

TC74HC32AFN(TP1) Toshiba America Electronic Components

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MM74HC32MX Rochester Electronics LLC

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Lifetime Buy Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS INC
Part Package Code SOIC SOIC
Package Description 0.150 INCH, PLASTIC, SOIC-14 SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.6235 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 19 ns 125 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 5
JESD-609 Code e3
Moisture Sensitivity Level 1
Terminal Finish MATTE TIN

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