TC74HC32AFN vs MM74HC32M feature comparison

TC74HC32AFN Toshiba America Electronic Components

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MM74HC32M Fairchild Semiconductor Corporation

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Pbfree Code No Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 0.150 INCH, MS-012, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown compliant
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 19 ns 25 ns
Propagation Delay (tpd) 95 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 11 7
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-609 Code e3
Moisture Sensitivity Level 1
Packing Method RAIL
Terminal Finish MATTE TIN

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