TC74HC367AFN vs HD74HC367RPEL feature comparison

TC74HC367AFN Toshiba America Electronic Components

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HD74HC367RPEL Renesas Electronics Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO INPUT
Control Type ENABLE LOW ENABLE LOW
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 150 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 4 4
Number of Functions 2 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 24 ns 30 ns
Propagation Delay (tpd) 165 ns 150 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.95 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1
Packing Method TR

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