TC74HC4050F vs 74HC4050NB feature comparison

TC74HC4050F Toshiba America Electronic Components

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74HC4050NB NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e4
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 125 ns 26 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Length 19.025 mm
Load Capacitance (CL) 50 pF
Supply Voltage-Nom (Vsup) 5 V

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