TC74HC4538AFN(TP2)
vs
M74HC123F1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
STMICROELECTRONICS
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
RETRIGGERABLE
RETRIGGERABLE; TRIGGERABLE FROM CLEAR INPUT ALSO
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
Length
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MONOSTABLE MULTIVIBRATOR
MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
63 ns
60 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
8.89 mm
Base Number Matches
2
1
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Terminal Finish
TIN LEAD
Compare TC74HC4538AFN(TP2) with alternatives
Compare M74HC123F1 with alternatives