TC74HC4538AFN(TP2) vs M74HC123F1 feature comparison

TC74HC4538AFN(TP2) Toshiba America Electronic Components

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M74HC123F1 STMicroelectronics

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature RETRIGGERABLE RETRIGGERABLE; TRIGGERABLE FROM CLEAR INPUT ALSO
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 63 ns 60 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 8.89 mm
Base Number Matches 2 1
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Terminal Finish TIN LEAD

Compare TC74HC4538AFN(TP2) with alternatives

Compare M74HC123F1 with alternatives