TC74HC595AFN-TP1ELP
vs
74HC594D-Q100
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NEXPERIA
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
PARALLEL OUTPUT IS REGISTERED; UNREGISTERED SERIAL SHIFT RIGHT OUTPUT
|
|
| Count Direction |
RIGHT
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e2
|
e4
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
PARALLEL IN SERIAL OUT
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Propagation Delay (tpd) |
155 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN COPPER/TIN SILVER
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
3.9 mm
|
|
| fmax-Min |
25 MHz
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2017-02-01
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TC74HC595AFN-TP1ELP with alternatives
Compare 74HC594D-Q100 with alternatives