TC74HCT00AF-TP2EL vs MM74HCT00SJ feature comparison

TC74HCT00AF-TP2EL Toshiba America Electronic Components

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MM74HCT00SJ onsemi

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Part Life Cycle Code End Of Life Active
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SOIC
Package Description SOP, SOP,
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2
Length 10.3 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 24 ns 29 ns
Qualification Status Not Qualified
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN COPPER/TIN SILVER
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm
Base Number Matches 1 3
Factory Lead Time 4 Weeks

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