TC74HCT00AFN vs M74HC00M1R feature comparison

TC74HCT00AFN Toshiba America Electronic Components

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M74HC00M1R STMicroelectronics

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Source Content uid TC74HCT00AFN M74HC00M1R
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NOT AVAILABLE IN JAPAN
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 24 ns 22 ns
Propagation Delay (tpd) 24 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TUBE
Terminal Finish NICKEL PALLADIUM GOLD

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