TC74HCT00AFN vs MC54HC132AJ feature comparison

TC74HCT00AFN Toshiba America Electronic Components

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MC54HC132AJ Freescale Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description SOP, SOP14,.25 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature NOT AVAILABLE IN JAPAN
Family HCT
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 24 ns 38 ns
Propagation Delay (tpd) 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 1 3
JESD-609 Code e0
Power Supplies 2/6 V
Terminal Finish Tin/Lead (Sn/Pb)

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