TC74HCT08AF-TP2 vs MC74VHCT08ADTR2G feature comparison

TC74HCT08AF-TP2 Toshiba America Electronic Components

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MC74VHCT08ADTR2G onsemi

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Pbfree Code No Yes
Rohs Code No
Part Life Cycle Code End Of Life Active
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code SOIC TSSOP-14
Package Description SOP, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT AHCT/VHCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 10.3 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 25 ns 14 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 4.4 mm
Base Number Matches 3 1
Manufacturer Package Code 948G
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC74VHCT08ADTR2G with alternatives