TC74HCT273AFW-TP1ELP
vs
100355MW8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DIE,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HCT
|
100K
|
| JESD-30 Code |
R-PDSO-G20
|
X-XUUC-N
|
| JESD-609 Code |
e2
|
|
| Length |
12.8 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Number of Bits |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Equivalence Code |
SOP20,.4
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Propagation Delay (tpd) |
38 ns
|
2.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.7 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN COPPER/TIN SILVER
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| Width |
7.5 mm
|
|
| fmax-Min |
24 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TC74HCT273AFW-TP1ELP with alternatives
Compare 100355MW8 with alternatives